亞 1 納米晶片技術
IBM 近日發表半導體技術突破
IBM 發布一項突破性的半導體技術，推出全球首款次一納米晶片技術。此項創新採用革命性的晶體管架構，達到 0.7 納米（即 7 埃）製程節點，能於指甲大小的晶片上，容納近千億個晶體管。
IBM 的半導體技術突破，得益於一項創新的三維納米堆疊架構，將晶體管垂直堆疊並交錯排列。此設計代表著與傳統平面設計的根本性決裂，讓業界即使在特徵尺寸逼近原子級別的情況下，仍能持續實現微縮化。
消費者對此創新技術應深感興趣，因其承諾為運算能力帶來重大飛躍——據推算，相比前代 2 納米製程晶片，效能可提升多達 50%，能源效益則可提升 70%。換言之，次一納米晶片技術，意味著更快速、更強大，且更節能的裝置。
英文原文
IBM has unveiled a groundbreaking semiconductor breakthrough with the introduction of the world's first sub-1-nanometer chip technology. The innovation features a revolutionary transistor architecture at the 0.7 nanometer, or 7 angstrom, node, which packs nearly 100 billion transistors onto a chip the size of a fingernail.
IBM's semiconductor breakthrough is enabled by a novel three-dimensional nanostack architecture that vertically stacks and staggers transistors. This design represents a fundamental departure from traditional planar designs and allows the industry to continue scaling even as features approach atomic dimensions.
Consumers would be interested in this innovation because it promises to deliver substantial leaps in computing capability, with projections indicating up to 50% more performance and 70% greater energy efficiency compared to the previous 2-nanometer node chips. In other words, the sub-1-nanometer chip technology entails faster, more powerful, and more energy-efficient devices.
- 來源
- Trend Hunter
- 發布
- 2026-06-29
- 品類
- Multimedia
- 出處
- newsroom.ibm